REBCO superconducting tapes are promising materials for next-generation energy systems, but suffer from significant AC loss under alternating magnetic fields.
To address this issue, we propose a novel filamentation technique called Substrate-Encoded Filamentation (SEF), in which non-superconducting patterns are pre-formed on the substrate prior to film growth.
This bottom-up approach enables ultrafine filament formation without thermal damage, offering a powerful pathway toward ultra-low-AC-loss superconducting devices.
